---
id: 4511
title: "Flash Dumping - Part II"
source_domain: blog.quarkslab.com
source_url: "https://blog.quarkslab.com/flash-dumping-part-ii.html"
published_at: "2018-03-06T23:00:00Z"
tags: ["reverse-engineering", "hardware", "flash", "kicad", "bga", "microsoldering"]
phying_url: "https://phying.com/item/4511"
lang: en
---

# Flash Dumping - Part II

## Summary

Part 2 of flash dumping: restoring a device after BGA flash removal — microsoldering a DIP8 adapter to the IoT board so the chip can be swapped without repeated desoldering.

## Intelligence Metadata

- **Sources:** blog.quarkslab.com
- **Published:** 2018-03-06T23:00:00Z
- **Original:** https://blog.quarkslab.com/flash-dumping-part-ii.html
- **Phying News:** https://phying.com/item/4511