---
id: 4520
title: "Flash Dumping - Part I"
source_domain: blog.quarkslab.com
source_url: "https://blog.quarkslab.com/flash-dumping-part-i.html"
published_at: "2017-09-04T22:00:00Z"
tags: ["hardware", "embedded", "pcb", "flash", "kicad", "desoldering"]
phying_url: "https://phying.com/item/4520"
lang: en
---

# Flash Dumping - Part I

## Summary

Flash dumping part one: when BGA packaging prevents probing, the chip is desoldered and a custom breakout board is designed with KiCAD to read, modify or intercept embedded device memory.

## Intelligence Metadata

- **Sources:** blog.quarkslab.com
- **Published:** 2017-09-04T22:00:00Z
- **Original:** https://blog.quarkslab.com/flash-dumping-part-i.html
- **Phying News:** https://phying.com/item/4520