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Flash Dumping - Part II

blog.quarkslab.com | research | #reverse-engineering | #hardware | #flash | #kicad | #bga | #microsoldering

Summary

Part 2 of flash dumping: restoring a device after BGA flash removal — microsoldering a DIP8 adapter to the IoT board so the chip can be swapped without repeated desoldering.
Published
Collected

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Related coverage

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